Six months after Samsung achieved 3nm production, Taiwan Semiconductor Manufacturing Company (TSMC) on Thursday announced mass production of its 3nm chips, which will outperform the 5nm chips found in the latest Pro iPhone models.
The company says it estimates that 3nm technology will produce end products with a request value of$1.5 trillion within five times of volume product.
Also, the chip- maker is also erecting a 3nm capacity at its point in state of Arizona in the US, in addition to expanding the 3nm capacity in Taiwan.
still, the Arizona fab will begin producing 4nm chips in 2024, followed by an alternate fab producing 3nm chips in 2026.
” This 3nm Volume product and Capacity Expansion form demonstrate that we’re taking concrete action to develop advanced technology and expand capacity in Taiwan,” TSMC Chairman Dr Mark Liu said in a statement.
The chipmaker also blazoned that its global R&D Centre in Taiwan’s Hsinchu Science Park will open in the alternate quarter of 2023, employing, 8,000 R&D labor force.
Further, it’s preparing for its 2nm fabs, which will be located in the Hsinchu and Central Taiwan Science Parks, with a aggregate of six phases pacing as planned.
According to the company, its 3nm process is the most advanced semiconductor technology in both power, performance, and area( PPA) and in transistor technology, and a full-knot advance from the 5nm generation.
Compared with the 5nm( N5) process, its 3nm process offers up to 1.6 X sense viscosity gain and 30 to 35 percent power reduction at the same speed and supports the innovative TSMC FINFLEX armature.